Low Temperature Cure Conductive Adhesive For Die Attach

Our new Low-Temperature Cure Conductive Adhesives will cure in 30 minutes at 80 Degree C or in seconds at 200 degree C, and has a moderate glass transition temperature (Tg) and modulus. It has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement. Unlike most conductive adhesives, it develops excellent conductivity with short, low-temperature cures. After curing for 30 minutes at 80 degree C, its electrical conductivity is 0.00006 ohm-cm.

The conductive adhesive is designed for Die-Attach applications in smart cards, circuit assembly, photonics or camera modules.